Soldering to a gold member

US4268585A · kind A · utility

Assignee

• Licentia Patent-Verwaltungs-GmbH · DE

Inventors

• Rolf Daur · Erbach, DE
• Herbert Hoffmann · Hennigsdorf, DE
• Günter Schmid · Hemhofen, DE

Key dates

• Filing date: Jun 1, 1978
• Grant date: May 19, 1981
• Expiry date: Jun 1, 1998

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/24917
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A method of applying solder to gold by applying a gold-tin intermediate layer to the gold and applying the solder over at least a portion of the intermediate layer. The method can be employed to produce a printed circuit unit composed of a printed circuit board, at least one gold member mounted on the board, a gold-tin intermediate layer bonded to at least a portion of the gold member, and solder bonded onto the intermediate layer.