Photoresist formulations
US4268610A · kind A · utility
18Cited by
2References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 5, 1979 |
| Grant date | May 19, 1981 |
| Priority date | — |
| Expiry date | Nov 5, 1999 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/121
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Photoresist compositions with improved adhesion properties are provided for use in making printed circuit boards, lithographic plates, relief image plates or cylinders and for other applications in the graphic arts. The subject invention also provides for methods and photoresist elements utilizing the photoresist compositions. The photoresist compositions include, in addition to a photopolymerizable compound, a photo initiator, a polymeric binder, and other optional additives and N-substituted benzotriazoles which serve as improved adhesion promoters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.