Forced vaporization heat sink for semiconductor devices
US4268850A · kind A · utility
38Cited by
7References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 11, 1979 |
| Grant date | May 19, 1981 |
| Priority date | — |
| Expiry date | May 11, 1999 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A fluid cooled heat sink is provided for use in cooling high power semiconductor devices. The heat sink includes a body formed of thermally conductive material having internal fluid passageways. Cooling fluid from an external source is passed through the heat sink. The preferred heat sink includes a pair of manifolds and means cooperating with the manifolds to allow selective interconnection of the interior passageways of the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.