Method of manufacturing hybrid integrated circuit assemblies
US4270265A · kind A · utility
3Cited by
7References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 1979 |
| Grant date | Jun 2, 1981 |
| Priority date | — |
| Expiry date | Mar 19, 1999 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53265
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Electronic components and a conductor for connecting the electronic components are placed in the component positioning holes and the conductor positioning recess which are formed in a plate-shaped jig. The jig with the components and the conductor is placed over a mounting board, and the assembly of these elements is heated in a suitable furnace so that the electronic components are connected to the mounting board and the conductor simultaneously, thereby to reduce the number of steps of manufacturing the hybrid integrated circuit assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.