Method for soldering aluminum
US4270986A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 12, 1979 |
| Grant date | Jun 2, 1981 |
| Priority date | — |
| Expiry date | Jul 12, 1999 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25F7/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and apparatus for soldering aluminum are disclosed. According to the method, the aluminum surface to be soldered is subject to conventional cleaning, then electrolytic cleaning and electrolytic etching, followed by electroplating a very thin layer of nickel on the cleaned and etched surface. The electrolytic cleaning, etching, and plating operations are all carried out by the use of a brush plating tool having an insulated handle portion, to one end of which a wire electrode encased in a porous covering composed of polyester felt is secured. After the plating has been completed, the surface may be soldered with conventional soft solders and non-corrosive fluxes, using conventional soldering techniques.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.