Molding resin composition
US4276388A · kind A · utility
7Cited by
1References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 21, 1979 |
| Grant date | Jun 30, 1981 |
| Priority date | — |
| Expiry date | Jun 21, 1999 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09D4/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A molding resin composition comprising (a) 40 to 70 parts by weight of an unsaturated polyester, (b) 60 to 20 parts by weight of a dialkyl ester of alkenyl succinic acid, and (c) 0 to 30 parts by weight of a polymerizable monomer other than the component (b) can produce molded articles excellent in mechanical properties, e.g. toughness and coating properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.