Device for mounting the molding of a bonded type windshield
US4278286A · kind A · utility
Inventors
Key dates
| Filing date | Mar 14, 1976 |
| Grant date | Jul 14, 1981 |
| Priority date | — |
| Expiry date | Mar 14, 1996 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB60J10/30
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
A device for mounting a windshield molding to a bonded-type windshield has an interposing member for securing to the glass and to a window frame, and a resiliently deformable fixing member to be engaged on the interposing member and serving to mount the windshield molding. The interposing member includes a holding portion adapted to support the windshield glass and to be secured to the window frame by a bonding agent, and a snug fit portion which is integrally formed with the holding position. The fixing member includes a first groove which receives the snug fit portion of the interposing member, for securing the two items together. The fixing member further has at least one second groove to receive and securely hold a portion of the windshield molding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.