Apparatus for securing tape to leads of semiconductor lead frame
US4279682A · kind A · utility
46Cited by
8References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 2, 1979 |
| Grant date | Jul 21, 1981 |
| Priority date | — |
| Expiry date | Nov 2, 1999 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/133
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for securing a tape to leads of a semiconductor lead frame, includes, a tape feeder, a punch for punching the tape and for pressing the punched tape against the lead frame, a mechanism for horizontally moving the lead frame and setting it in the punch and the press, and a mechanism for adjusting the timing of the feeder, the punch, the press and the moving mechanism. The punch and the press include a fixed upper die on which the lead frame rests and in which the tape is supported, the punch being movable against the tape for punching out a portion of the tape and for pressing it against the lead frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.