Patent · US Expired

Non-conductive substrate for a printed circuit and method of manufacture

US4281038A · kind A · utility

18Cited by

5References

13Claims

0Family size

Assignee

Preh, Elektrofeinmechanische Werke Jakob Preh, Nachf. GmbH & Co. · DE

Inventors

Peter Ambros · Leutershausen, DE
Hermann Geyer · Vestenbergsgreuth, DE

Key dates

Filing date	Dec 10, 1979
Grant date	Jul 28, 1981
Priority date	—
Expiry date	Dec 10, 1999

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/2998
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

The disclosure is of a substrate or supporting board for supporting printed ircuits and the method of its manufacture. The boards of the invention are preferably made of a high-temperature resistant thermoplastic, sensitized to receive a printed circuit element by the dispersion of coated iron or copper particles in the thermoplastic matrix. The coating is a bonding assistant.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.