Clay cutting lathe and method
US4281569A · kind A · utility
1Cited by
7References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 28, 1979 |
| Grant date | Aug 4, 1981 |
| Priority date | — |
| Expiry date | Dec 28, 1999 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T82/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A lathe comprising a rotor assembly which may be manually rotated and which has a peripheral portion around which moist pottery clay may be packed. A first cutting member can be mounted on a tool support for the lathe and used to cut grooves into the clay generally to the depth at which the surface of the object will be formed, whereupon a second cutting member with a continuous edge can be mounted on the tool support and used to cut away the clay ridges and shape the finished surface on the object. The object is then allowed to dry, which releases it from the rotor assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.