Method of assembling an encapsulated chip capacitor
US4282645A · kind A · utility
8Cited by
7References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 22, 1979 |
| Grant date | Aug 11, 1981 |
| Priority date | — |
| Expiry date | Oct 22, 1999 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G9/012
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An encapsulated chip capacitor is made by inserting capacitor bodies between two channels of L-shaped cross-section, electrically connecting the capacitor cathodes to one channel and the anodes to the other thus providing terminals, filling the resulting assembly with insulating encapsulant, curing it, and separating the cured assembly into individual chip capacitors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.