Patent · US Expired

Process for cementing semiconductor discs onto a carrier plate

US4283242A · kind A · utility

36Cited by

8References

3Claims

0Family size

Assignee

Wacker-Chemitronic Gesellschaft fur Elektronik Grundstoffe mbH · DE

Inventors

Dieter Regler · Burghausen, DE
Bruno Meissner · Burghausen, DE
Alfred Moritz · Burghausen, DE

Key dates

Filing date	Sep 7, 1979
Grant date	Aug 11, 1981
Priority date	—
Expiry date	Sep 7, 1999

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T156/11
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

An apparatus and process for cementing semiconductor discs onto a carrier ate, wherein after the carrier plate is coated with a layer of adhesive substance, the discs are applied to the adhesive layer and a vacuum-tight sealing dome is placed over the carrier plate to define a sealed, hollow space. A chemically-inert elastic diaphragm is clamped within the dome 0.2 to 1.5 mm above the free surface of the discs, to divide the hollow space into two sections or subchambers which are initially simulataneously evacuated. Then, air pressure is applied to the upper section, so that the discs are pressed by the diaphragm onto the cement layer. Air pressure is then subsequently fed to the lower hollow space, so that the dome can be removed from the carrier plate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.