Apparatus for soldering components mounted at printed wiring boards
US4284225A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 20, 1979 |
| Grant date | Aug 18, 1981 |
| Priority date | — |
| Expiry date | Nov 20, 1999 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K3/0676
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A conveyor device containing transport frames, each of which is structured for receiving a printed circuit or wiring board carrying circuit components and guided at their leading and their trailing corners by related guide tracks, leads the transport frames to a solder bath, where the transport device lowers the transport frames together with the printed circuit boards towards the solder bath and again raises the same therefrom. During the course of travel of a transport frame containing a printed circuit board carrying one or more of the circuit components through the solder bath one side of the printed circuit board is immersed into the solder bath and then again lifted out of the solder bath. On the one hand, to prevent that the connection leads or wires protruding from the printed circuit board, during the immersion into the soldering bath, hold back air and, on the other hand, to prevent that during lift-out of the printed circuit board from the solder bath solder bridges will form between the protruding leads or wires, the guide tracks, viewed in the direction of conveying, possess descending ramps whose spacing from one another is less than the length of a transort frame. Fo…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.