Hot-melt pressure sensitive adhesive compound
US4284541A · kind A · utility
38Cited by
1References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 13, 1979 |
| Grant date | Aug 18, 1981 |
| Priority date | — |
| Expiry date | Nov 13, 1999 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A hot-melt compound comprising 30 to 70% by weight of a modified ethylene..alpha.-olefin copolymer rubber having a melt index of at most 500 and prepared by grafting an unsaturated carboxylic acid or derivative thereof to an ethylene..alpha.-olefin copolymer rubber or a partial ester of said modified copolymer rubber and 70 to 30% by weight of a tackifier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.