Fabrication of film resistor circuits
US4284970A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 9, 1979 |
| Grant date | Aug 18, 1981 |
| Priority date | — |
| Expiry date | Aug 9, 1999 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49099
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of fabricating thin and thick film resistors which results in stable resistance characteristics, ability to withstand high current or voltage and a precise method of trimming small resistors. After the resistor film (20) and contacts (22 and 23) thereto are formed, the resistors are trimmed by a cut (24) along the length dimension so that the width of the current path is reduced uniformly. The waste portion of the resistor is then separated from the circuit by a cut (27) along its width. Current crowding in the vicinity of the cut is therefore essentially eliminated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.