Method for producing a metallic pattern upon a substrate
US4288282A · kind A · utility
14Cited by
3References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 1979 |
| Grant date | Sep 8, 1981 |
| Priority date | — |
| Expiry date | Sep 28, 1999 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A metallic foil is laminated to a transparent substrate with a photopolymerizable adhesive. An outer layer of photoresist is used in etching a pattern in the foil. The etched foil itself is then used as a resist in the complete removal of the uncovered portions of the adhesive, leaving the transparency of the revealed substrate material totally unimpaired. Finally, the remaining adhesive is hardened by polymerization resulting from exposure to ultraviolet light passed through the substrate from the unlaminated side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.