Patent · US Expired

Method of forming a microscopic pattern

US4288283A · kind A · utility

21Cited by
4References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 8, 1980
Grant dateSep 8, 1981
Priority date
Expiry dateJan 8, 2000

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG03F7/091
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

A method of forming a microscopic pattern wherein the object to be etched is overlaid with a film made of a material which is highly immune to etching and further provided with a reflection reducing film. Thus, the reflection of the irradiating ultraviolet rays by the underlying layer is effectively prevented.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.