Method of making an embossed pattern on an information bearing substrate
US4288528A · kind A · utility
11Cited by
12References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 11, 1979 |
| Grant date | Sep 8, 1981 |
| Priority date | — |
| Expiry date | Jun 11, 1999 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/146
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An improved process for forming an embossed pattern through the use of a writing concentrated beam opening holes in a film capable of undergoing residue free evaporation. A layer of photoresist is overlayed with the film and upon being exposed and processed the layer supplies the prospective embossed pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.