Solid state device mounting and heat dissipating assembly
US4288839A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 18, 1979 |
| Grant date | Sep 8, 1981 |
| Priority date | — |
| Expiry date | Oct 18, 1999 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
By providing a retaining surface, upon which a solid state device is positioned, and a device securing means movable into and out of compression engagement with a portion of the solid state device, for securely mounting and retaining the device in sandwiched interengagement between the securing means and the retaining surface, a unique solid state device mounting assembly is achieved which eliminates fastening means extending through the solid state device for secure mounting thereof. In addition, the assembly incorporates heat dissipating means cooperatingly associated with the retaining surface for absorbing and dissipating heat generated by the solid state device. In the preferred embodiment, an elongated unitary one-piece bracket member is employed for securely mounting a plurality of solid state devices in the single bracket member, with the bracket member being mountable to a heat dissipating surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.