Heat curable molding composition
US4293479A · kind A · utility
17Cited by
4References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 6, 1979 |
| Grant date | Oct 6, 1981 |
| Priority date | — |
| Expiry date | Dec 6, 1999 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K7/20
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
What is disclosed is an improved heat curable molding composition which has increased flowability in the mold. The improvement is gained by the use of a fine, spherical noncrystalline filler along with the normal molding compound fillers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.