Method for production of printed circuits by electroless metal plating
US4293592A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 6, 1976 |
| Grant date | Oct 6, 1981 |
| Priority date | — |
| Expiry date | Dec 6, 1996 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1415
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method is provided for producing printed circuits by electroless deposition of metal on an insulating substrate to form a circuit film which comprises contacting an insulating substrate having initiator on a negative pattern of a thermo-setting resin whose activity for deposition of initiator for electroless metal plating is substantially reduced and on a positive pattern for circuit with an aqueous solution of an organic acid and hydrochloric acid and/or nitric acid before electroless plating the positive pattern by immersing the substrate in an electroless metal plating solution to substantially dissolve and remove the initiator on the surface of said negative pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.