Process for producing strippable copper on an aluminum carrier and the article so obtained
US4293617A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 26, 1979 |
| Grant date | Oct 6, 1981 |
| Priority date | — |
| Expiry date | Dec 26, 1999 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0726
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process is provided for producing a composite structure suitable for use in connection with the manufacture of printed circuits which includes a carrier layer of aluminum and a covering layer of copper which structure is characterized by the fact that the copper layer is tenaciously bonded to the carrier layer but readily separable therefrom by mechanical means without destroying the integrity of the copper layer which process comprises the steps of (a) providing a layer of aluminum foil, (b) cleaning at least one major surface of the aluminum foil to remove surface contaminants therefrom, (c) positioning the aluminum foil in a suitable electrolyte and passing electric current therethrough in such a manner that the foil is rendered cathodic to activate the surface of the foil, (d) positioning the activated foil in a suitable electrolyte and passing electrical current therethrough in such a manner that the foil is rendered anodic and a layer of aluminum oxide is formed on the surface thereof, and (e) electrodepositing a thin layer of copper on the anodically treated surface of aluminum foil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.