Method of manufacturing a hybrid integrated circuit
US4294009A · kind A · utility
24Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 1979 |
| Grant date | Oct 13, 1981 |
| Priority date | — |
| Expiry date | Jun 28, 1999 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A hybrid integrated circuit having a partially enamelled steel support. The process starts with an unprocessed steel plate 20 which is first treated to allow bonding of a coat of enamel. Before selected areas are masked by a layer 21, for example of an organic material. After an enamel composition 22 is deposited on all areas of the plate, this deposit is then removed from the masking layer 21. The enamel is then baked at high temperature and the masking is burnt and volatilized. The selected, bared areas of the plate are metallized. They are used as areas for soldering or gluing semiconductor chips 24.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.