Electro-optically assisted bonding
US4294602A · kind A · utility
27Cited by
4References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 9, 1979 |
| Grant date | Oct 13, 1981 |
| Priority date | — |
| Expiry date | Aug 9, 1999 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S65/04
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of bonding a cover glass to a semiconductor substrate having conductors thereon. The cover glass and the semiconductor substrate are placed in a relatively high voltage field and heated to induce ion drift in the glass and improved conductivity in the substrate. Additional localized heating softens the cover glass in the vicinity of the conductors permitting the cover glass to flow around the conductors and to be drawn into contact and bonded with the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.