Apparatus for plating
US4298446A · kind A · utility
6Cited by
6References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 18, 1980 |
| Grant date | Nov 3, 1981 |
| Priority date | — |
| Expiry date | Apr 18, 2000 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus optimum for partially plating such rectangular objects as an IC lead frame obtained by subjecting thin metal pieces to press working and etching. The apparatus is characterized in that a support carriage aligns and supports the plurality of objects to be plated in advance, positioning means align the objects as regards the plating tank the lead wire as a cathode is contacted at the same time with the upper side of each object to be plated and the whole of the plural number of objects to be plated is masked, thereby performing plating by jetting the plating liquid onto respective portions to be plated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.