Patent · US Expired

Method and apparatus for testing the clamp of a solderless electric connection

US4299131A · kind A · utility

3Cited by

2References

11Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Max Seitz
Hans P. Thumm · Munich, DE
Gunther Hagen · Munich, DE
Gerald Grad · Munich, DE

Key dates

Filing date	Jan 8, 1980
Grant date	Nov 10, 1981
Priority date	—
Expiry date	Jan 8, 2000

Classification

Technology area (CPC G)Physics
CPC primaryG01R31/66
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

An apparatus and method for testing the mechanical strength of a solderless electrical connection having a clamp deformable to retain a bundle of wires against a pin has a double-T-shaped cross piece over which a clamp to be tested is slided. The cross piece has a vertical bore therein for receiving a pressure-applying die for subjecting the clamp to a test pressure. The die is actuated by a motor-driven spindle and a transducer transforms the applied pressure to a voltage for display. Pressure is applied following a pre-determined curve corresponding to worst cast configurations of a wire bundle which may result in failure of the clamp to securely retain the bundle.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.