Magnetic target plate for use in magnetron sputtering of magnetic films
US4299678A · kind A · utility
43Cited by
6References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 23, 1979 |
| Grant date | Nov 10, 1981 |
| Priority date | — |
| Expiry date | Jul 23, 1999 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3408
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The advantages of magnetron sputtering can be applied to magnetic target materials by substantially reducing the saturation magnetization of the target material temporarily, such as by heating the target material to its Curie point, and magnetron sputtering the magnetic material while in such a state of reduced magnetization. Disclosed herein is a magnetic target plate which is structured to facilitate heating of the plate to its Curie point by the thermal energy inherent in the conventional sputtering process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.