Multilayer circuit board
US4299873A · kind A · utility
70Cited by
6References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 7, 1980 |
| Grant date | Nov 10, 1981 |
| Priority date | — |
| Expiry date | Apr 7, 2000 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer circuit board obtained by laminating and bonding a plurality of ceramic substrates, each substrate having holes therein and a conductive circuit pattern on at least one surface thereof, and bonding layers between each ceramic substrate, said bonding layers containing an organic or inorganic adhesive and an inorganic filler and having good electrical insulating properties, good thermal conductivity and a larger coefficient of thermal expansion than that of the ceramic substrate shows good thermal conductivity, wiring accuracy and productivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.