Hot melt adhesive composition
US4299934A · kind A · utility
7Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 2, 1980 |
| Grant date | Nov 10, 1981 |
| Priority date | — |
| Expiry date | Oct 2, 2000 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31786
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Hot melt adhesive compositions having low melt viscosity and high adhesive strength are disclosed. The compositions include polyesters comprising 1,6-hexanediol and terephthalic acid, blended with a polymeric material comprising a vinyl aromatic polymer derived from a monomer of the formula ##STR1## wherein R is hydrogen or an alkyl group containing 1 to 4 carbon atoms and R.sub.1 is hydrogen, chlorine, alkyl from 1 to 4 carbon atoms or phenyl.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.