Patent · US Expired

Process for cementing semiconductor discs to carrier plates and product so obtained

US4300965A · kind A · utility

3Cited by

7References

8Claims

0Family size

Assignee

Wacker-Chemitronic Gesellschaft fur Elektronik Grundstoffe mbH · DE

Inventors

Dietrich Schmidt · Camp Hill, US
Bruno Meissner · Burghausen, DE
Heinz-Jorg Rath · Burghausen, DE
Dieter Regler · Burghausen, DE
Jurgen Voss · Wiesbaden, DE

Key dates

Filing date	Feb 7, 1977
Grant date	Nov 17, 1981
Priority date	—
Expiry date	Feb 7, 1997

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T156/11
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Process for cementing semiconductor discs to a carrier plate for subsequent olishing, which comprises applying to the discs a cementing solution being composed of PA0 (a) a resin of a melting range between 50.degree. and 180.degree. C. and a melt viscosity between 1000 and 6000 P; PA0 (b) a substance acting as plasticizer for the resin at cementing temperatures; and PA0 (c) a solvent for the resin and the plasticizer, which evaporizes at cementing temperatures, while avoiding during the application the occlusion of air bubbles between discs and cementing layer, and exerting pressure onto the plates at a temperature between cementing temperatures and 30.degree. C. below the same. The invention also comprises the carrier plate carrying one or more discs cemented thereto by the above process.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.