Arrangement for automatically fabricating and bonding semiconductor devices
US4301958A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 24, 1979 |
| Grant date | Nov 24, 1981 |
| Priority date | — |
| Expiry date | Aug 24, 1999 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49829
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A system for automatically fabricating and bonding semiconductor devices using lead frames and semiconductor chips, which comprises means for supplying a continuous strip of lead frames, an automatic die bonder for mounting semiconductor chips on the lead frames and forming sheets thereof, buffer means for temporarily storing the sheets formed of the lead frames and semiconductor chips mounted thereon, and at least one automatic wire bonder, all of these apparatuses being arranged in a line. The sheets are automatically and successively fed from the automatic die bonder to the buffer means and from the buffer means to the automatic wire bonder by means of a series of automatic conveyor mechanisms.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.