Polyamide laminates containing copper salts
US4302511A · kind A · utility
7Cited by
7References
58Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 1980 |
| Grant date | Nov 24, 1981 |
| Priority date | — |
| Expiry date | Dec 29, 2000 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31938
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A laminate structure having at least one layer of a polyamide containing from 0.001 to 1.0 parts, based on the weight of the polyamide, of a copper cation containing material. The polyamide layer is contiguous to at least one opposing layer. The opposing layer contains an effective amount of functional groups selected from the group consisting of acid groups, metal salts of the acid, acid anhydrides, carbonates and mixtures thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.