Headphone construction
US4302635A · kind A · utility
97Cited by
9References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 4, 1980 |
| Grant date | Nov 24, 1981 |
| Priority date | — |
| Expiry date | Jan 4, 2000 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R5/0335
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A headphone includes a pair of ear cup assemblies attached to a headband. Each ear cup assembly includes a cushion, an earplate, a back plate and an acoustic transducer. These elements snap together and are held together by integral fasteners. Each ear cup assembly is attached to the headband by a ring-shaped yoke which is entrapped between the assembled back plate and ear plate. The result is a durable, lightweight structure which is easy to assemble on a mass production basis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.