Compound spring contact
US4303294A · kind A · utility
34Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 1980 |
| Grant date | Dec 1, 1981 |
| Priority date | — |
| Expiry date | Mar 17, 2000 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/193
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An improved contact is disclosed for use in zero insertion force connectors. The subject contact is a compound spring formed from a single piece of metal stock, a portion of which is skived to achieve dual thickness stock. The contact is formed as a compound beam such that the loading thereof provides differential deflection of the contact so that a wiping action is performed at a point of engagement with a circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.