Molded lead frame dual in line package including a hybrid circuit
US4303934A · kind A · utility
33Cited by
9References
1Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 30, 1979 |
| Grant date | Dec 1, 1981 |
| Priority date | — |
| Expiry date | Aug 30, 1999 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A molded dual in line package is disclosed which has at least one cavity in a first major molded surface thereof into which an integrated circuit chip can be mounted and wire bonded. After the circuit is tested and adjusted, the cavity is sealed with a metal plate. Other embodiments are disclosed which include a second cavity in a second major molded surface of the package which may house or contain a second integrated circuit, an epoxy sealer, or a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.