Method of fabricating a multi-layer structure for detector array module
US4304624A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 28, 1977 |
| Grant date | Dec 8, 1981 |
| Priority date | — |
| Expiry date | Nov 28, 1997 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A photo-detector array module is disclosed wherein: (a) the focal plane array of photo-detectors is in electrical contact with thin film conductors supported on thin ceramic layers extending perpendicular to the focal plane, and (b) sub-module structures, each composed of such layers, have complementary shapes (such as O-shaped and "I-shaped") to provide "component wells" for electronics within the three dimensional space defined at one end by the two-dimensional area of the focal plane. In order to fabricate such a module satisfactorily, a method is disclosed in which each unimaged layer (i.e., layer whereon the thin film conductors have not yet been photo-delineated) is individually laminated to the prior structure, and the photo-delineation process on the unimaged layer includes an optical alignment step to insure alignment of the thin film conductors on each layer with those on preceding layers. PAC CROSS REFERNCE TO RELATED APPLICATION
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.