Line-of-sight deposition method
US4305801A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 1980 |
| Grant date | Dec 15, 1981 |
| Priority date | — |
| Expiry date | Apr 16, 2000 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/22
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A line-of-sight method of depositing a film having substantially 100% of theoretical density on a substrate. A pressure vessel contains a target source having a surface thereof capable of emitting particles therefrom and a substrate with the source surface and the substrate surface positioned such that the source surface is substantially parallel to the direction of the particles impinging upon the substrate surface, the distance between the most remote portion of the substrate surface receiving the particles and the source surface emitting the particles in a direction parallel to the substrate surface being relatively small. The pressure in the vessel is maintained less than about 5 microns to prevent scattering and permit line-of-sight deposition. By this method the angles of incidence of the particles impinging upon the substrate surface are in the range of from about 45.degree. to 90.degree. even when the target surface area is greatly expanded to increase the deposition rate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.