Patent · US Expired

Filler-containing molding composition and process for its manufacture

US4307009A · kind A · utility

16Cited by

3References

6Claims

0Family size

Assignee

Hoechst GmbH · DE

Inventors

Walter Luders · Neu-Isenburg, DE
Karlheinz Burg
Walter Herwig · Bad Soden, DE
Ulrich van Spankeren · Hofheim, DE

Key dates

Filing date	Mar 14, 1980
Grant date	Dec 22, 1981
Priority date	—
Expiry date	Mar 14, 2000

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08K5/42
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

In filler-containing molding compositions a very good compatibility between the hydrophilic filler and the hydrophobic polymer matrix is obtained by using as adhesion promotor alkali metal salts of alkyl or alkylene-sulfonic acids or alkyl sulfates, the derivatives thereof and the acids on which the salts are based. The flow properties of the molding compositions and the mechanical properties of the shaped articles made therefrom are improved.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.