Imaging light-sensitive material with etchable opaque polyamide underlayer and light-sensitive resist overlayer
US4307172A · kind A · utility
9Cited by
9References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 1980 |
| Grant date | Dec 22, 1981 |
| Priority date | — |
| Expiry date | Apr 30, 2000 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/11
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed is an imaging light-sensitive material which comprises a transparent substrate, [I] a polyamide layer containing an alcohol-soluble polyamide as the major component and having a thickness of from 2 to 11 microns and [II] a light-sensitive layer having a thickness of from 0.5 to 5 microns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.