Masking agent for the deposition of a material and method for such a deposition using this masking agent
US4307181A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 1980 |
| Grant date | Dec 22, 1981 |
| Priority date | — |
| Expiry date | Mar 19, 2000 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/143
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
To prepare a masking agent resistant to temperature, one adds silica powder to a photoresist. The mixture thus obtained is used to produce selective deposition of a layer of material on a substrate. The mixture of photoresist and silica powder serves as a photo-sensitive protective material which is then eliminated partially by selective exposure to light and use of a photographic developer. The temperatures involved in the deposition of the layer of desired material, for instance tin oxide, are about 500.degree. C. (deposition in the vapor phase), and the photo-sensitive material would be liable to destruction if it did not contain silica powder. It is then necessary, once the deposition of the desired material has been effected, to increase the temperature of the workpiece up to about 540.degree. C. to destroy and, hence, to eliminate the protective material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.