Method of and apparatus for reactively sputtering a graded surface coating onto a substrate

US4309261A · kind A · utility

Assignee

• The University of Sydney · AU

Inventors

• Geoffrey Harding · Hamburg, DE
• David McKenzie · Chatswood, AU
• Brian Window · Hornsby, AU
• Anthony R. Collins · Sydney, AU

Key dates

• Filing date: Jul 3, 1980
• Grant date: Jan 5, 1982
• Expiry date: Jul 3, 2000

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02E10/40
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A graded surface coating is reactively sputtered onto a tubular substrate by advancing the substrate in an axial direction through a cylindrical sputtering chamber in the presence of a sputter supporting gas. The sputtering chamber includes a cathode liner from which metal is sputtered onto the substrate. A reactive gas is directed into the sputtering chamber from a feed point outside of the chamber, whereby reactive sputtering occurs within the chamber. The reactive gas is induced to flow into the chamber in a direction counter to the direction of advancement of the substrate whereby, as the substrate is progressively advanced through the chamber and the applied coating gradually increases in thickness, the proportion of the reactive gas constituent in the coating increases relative to the metal constituent proportion with increasing thickness of the coating.