Glass and hermetic seal
US4309507A · kind A · utility
8Cited by
5References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 1981 |
| Grant date | Jan 5, 1982 |
| Priority date | — |
| Expiry date | Feb 23, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T403/217
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An improved sealing glass composition for making compression glass electrical feedthroughs in semiconductor device packages is described wherein the improved sealing glass consists essentially of (by weight percent) 63-68% SiO.sub.2, 3-6% Al.sub.2 O.sub.3, 8-9% K.sub.2 O, 5-6% Na.sub.2 O, 0.5-1.5% Li.sub.2 O, 2-4% BaO, 5-7% SrO, 2-4% CaO, 0.5-1.5% MgO, 0.5-1.5% TiO.sub.2, and 0.5-1.5% B.sub.2 O.sub.3.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.