Patent · US Expired

Molding compositions containing high-molecular weight linear polyester

US4309518A · kind A · utility

8Cited by
12References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 25, 1980
Grant dateJan 5, 1982
Priority date
Expiry dateJul 25, 2000

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S525/927
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

Molding compositions comprising PA0 A. 60-97% by weight, based on the weight of the total composition, of a poly(alkylene terephthalate) and PA0 B. 3-40% by weight, based on the weight of the total composition, of a polyether ester amide, component A being the condensation product of PA1 (1) 80-100 molar percent of terephthalic acid, and PA1 (2) 0-20 molar percent of another hydrocarbonaromatic-,cycloalkane- or alkane-dicarboxylic acid of 6-36 C atoms, with PA1 (3) 80-100 molar percent of a 1,n-alkanediol of 2-4 C atoms, wherein n is an integer of 2 to 4, and PA1 (4) 0-20 molar percent of another alkane- or cycloalkane-diol of 3-12 C atoms, component B being the condensation product of PA2 (1) at least one polaymide-forming .omega.-aminoalkanecarboxylic acid or alkanelactam, each of 10-17 carbon atoms, PA2 (2) a poly(alkylene glycol) having a molecular weight of 400 to 6000, PA2 (3) at least one other alkane-, cycloalkane- or hydrocarbon aromatic dicarboxylic acid of 4-11 carbon atoms, wherein the weight ratio of component B(1) to [B(2)+B(3)] is 20:80 to 98:2, and the hydroxy and carboxy groups in [B(2)+B(3)] are present in amounts approximately equivalent to each other, have unusu…

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.