Impulse jet head using etched silicon
US4312008A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 2, 1979 |
| Grant date | Jan 19, 1982 |
| Priority date | — |
| Expiry date | Nov 2, 1999 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2002/14379
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
An improved impulse jet head structure utilizing etched silicon as the body of the structure. A silicon substrate is etched so as to form a nozzle groove, cavity, and ink supply groove. A layer of glass or other material is bonded to the top of the substrate so as to enclose the cavity and define, along with the grooves, and ink supply conduit and a nozzle conduit. A second layer of glass or other material is bonded to the bottom of the substrate and comprises the bottom surface of the cavity. A piezoelectric crystal driver is bonded to the bottom layer in a position corresponding to the location of the reservoir. An ink supply tube is bonded to the upper layer in a location above the supply groove and delivers ink to the head structure. The etching process may be utilized to form either single or multiple orifice head structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.