Multilayer circuit boards
US4313026A · kind A · utility
32Cited by
6References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 26, 1979 |
| Grant date | Jan 26, 1982 |
| Priority date | — |
| Expiry date | Oct 26, 1999 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multilayer circuit board (10) for putting semiconductor devices thereon consists of conductor layers (6, 60, 61, 62, 63) made of a metal selected from the group consisting of Au, Ag, Cu and an alloy thereof, insulating material (2, 7) made of glass-ceramic and an alumina sintered plate (1). The glass-ceramic is comprised of borosilicate glass and alumina and has a low dielectric constant and a thermal expansion coefficient approaching that of the semiconductor devices. The alumina sintered plate (1) is placed between the ground and supply voltage conductor layers (62, 63) and the signal conductor layers (60).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.