Apparatus for improving flatness of polished wafers
US4313284A · kind A · utility
67Cited by
7References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 27, 1980 |
| Grant date | Feb 2, 1982 |
| Priority date | — |
| Expiry date | Mar 27, 2000 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B55/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Apparatus for improving polished wafer flatness such as slices of semiconductor materials through mounting of the wafers onto a deformable thin disc carrier which is mounted through a resilient device to a rotable pressure plate, the combined mounting being rotably engageable with a rotable turntable supported polishing surface, the turntable having an axis of rotation to edge bow away from the mounted wafers. The carrier is deformed to a concave shape opening toward the bowed table; thus permitting the mounted wafers to achieve through rotation polishing, uniformly improved flatness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.