Method for elevated-temperature bonding of material with different coefficients of thermal expansion
US4314866A · kind A · utility
6Cited by
4References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 9, 1980 |
| Grant date | Feb 9, 1982 |
| Priority date | — |
| Expiry date | Dec 9, 2000 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2307/734
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method to eliminate stresses and consequent warping in elevated-temperature cured adhesive bonded parts with different coefficients of thermal expansion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.