Resin compositions
US4315086A · kind A · utility
176Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 16, 1980 |
| Grant date | Feb 9, 1982 |
| Priority date | — |
| Expiry date | Jul 16, 2000 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/93
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition comprising a resin composition comprising 5 to 95% by weight of a polyphenylene oxide and 95 to 5% by weight of a polyamide and 0.01 to 30 parts by weight of a member selected from the group consisting of (A) liquid diene polymers, (B) epoxy compounds and (C) compounds having in the molecule both of (a) an ethylenic carbon-carbon double bond or a carbon-carbon triple bond and (b) a carboxylic acid, acid anhydride, acid amide, imido, carboxylic acid ester, amino or hydroxyl group per 100 parts by weight of the total of the polyphenylene oxide and polyamide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.