Heat sink laser diode array
US4315225A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 24, 1979 |
| Grant date | Feb 9, 1982 |
| Priority date | — |
| Expiry date | Aug 24, 1999 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/926
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A laser diode is soldered between metal plates for intimate thermal and electrical contact. The plates are prefabricated and are provided with an insulated spacer therebetween. The two metal plates are held together in a preferred orientation by the spacer which is firmly adhered and sealed to the two plates during the diode soldering operation. The laser diodes so mounted can be tested in this configuration and after testing are formed into an array by stacking the laser diode subassemblies providing spacer elements therebetween and series contacts from one end to the other of the array so that an array of laser diodes with matched characteristics can be constructed in a line which may not be in alignment with the total package to provide an intense light output at a predetermined wavelength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.