Method and apparatus for wax mounting of thin wafers for polishing
US4316757A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 3, 1980 |
| Grant date | Feb 23, 1982 |
| Priority date | — |
| Expiry date | Mar 3, 2000 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28D5/0082
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Apparatus and method for wax mounting of thin wafers such as slices of semiconductor silicon to a carrier for polishing wherein the carrier is heated after being coated with wax which is maintained in a sticky condition by the heated carrier. A chamber is utilized for enclosing the thin wafers on resilient supports with the sticky wax-coated, heated carrier disposed above them. The chamber has an air tight seal permitting it to be evacuated. After evacuation a pneumatic cylinder is utilized to press the carrier against the wafers, which adhere to the sticky wax coating. The chamber is vented then to atmospheric pressure, the wafers remaining mounted by the wax coating to the carrier for subsequent polishing. The method avoids entrapment of gas bubbles between wafers and carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.